| Description | . . . . . . . . . . . . . . . . . . . . 19 Section 2. Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Section 3. Resets and Interrupts . . . . . . . . . . . . . . . . . . . 37 www.DataSheet4U.com Section 4. Addressing Modes . . . . . . . . . . . . . . . . . . . . . 55 Section ... |
| Features |
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Programming Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Memory Space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Arithmetic Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Binary-Coded Decimal (BCD) Arithmetic Support . . . . . . . . . .22 High-Level Language Support . . . . . . . . . . . . . . . . . . . . . . . . . 22 Low-Power ...
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| Datasheet |
 CPU08 Datasheet - 2.37MB |
| Part Number | Description |
|---|---|
 ETC |
CPU Module CPU Module March 1999 GFK-1536C Product Information _________________________________ Revision: Firmware version: Compatibility: CPU001-BB 1.10 VersaPro software version 1.0 Module Installation _________________________________ 1 Modules must be mounted on a horizontal DIN rail. 1. 2 133.35mm (5.25in) Allow sufficient finger clearance for opening CPU door. Allow adequate clearance for serial port cables. Allow adequate space for power wiring. New Features ____________________________________ This version of CPU001 provides: 2. 3. S S Support for intelligent I/O modules. Scaling function blocks. Two new function blocks can be used to scale input data. One function block is for unipola... |
 Freescale Semiconductor |
Reference Manual Incorporated information covering HCS12 Family of 16-bit MCUs throughout the book. Updated to meet Freescale identity guidelines. March, 2006 4.0 MEM Instruction — Corrected bulleted listing under Description heading. 209 Page Number(s) Throughout Throughout Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. © Freescale Semiconductor, Inc., 2002, 2006. All rights reserved. CPU12 Reference Manual, Rev. 4.0 Freescale Semiconductor 3 Revision History CPU12 Reference Manual, Rev. 4.0 4 Freescale Semiconductor List of Chapters Chapter 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Cha... |
 International Rectifier |
IGBT SIP MODULE Fast IGBT The IGBT technology is the key to International Rectifier's advanced line of IMS (Insulated Metal Substrate) Power Modules. These modules are more efficient than comparable bipolar transistor modules, while at the same time having the simpler gate-drive requirements of the familiar power MOSFET. This superior technology has now been coupled to a state of the art materials system that maximizes power throughput with low thermal resistance. This package is highly suited to motor drive applications and where space is at a premium. IMS-1 Absolute Maximum Ratings Parameter VCES IC @ TC = 25°C IC @ TC = 100°C ICM ILM IF @ TC = 100°C IFM VGE VISOL PD @ TC = 25°C PD @ TC = 100°C TJ TSTG Collector-... |
International Rectifier |
IGBT SIP MODULE Short Circuit Rated UltraFast IGBT The IGBT technology is the key to International Rectifier's advanced line of IMS (Insulated Metal Substrate) Power Modules. These modules are more efficient than comparable bipolar transistor modules, while at the same time having the simpler gate-drive requirements of the familiar power MOSFET. This superior technology has now been coupled to a state of the art materials system that maximizes power throughput with low thermal resistance. This package is highly suited to power applications and where space is at a premium. These new short circuit rated devices are especially suited for motor control and other totem-pole applications requiring short circuit withstand capability. IMS-1 Units V... |
International Rectifier |
IGBT SIP MODULE Short Circuit Rated Fast IGBT The IGBT technology is the key to International Rectifier's advanced line of IMS (Insulated Metal Substrate) Power Modules. These modules are more efficient than comparable bipolar transistor modules, while at the same time having the simpler gate-drive requirements of the familiar power MOSFET. This superior technology has now been coupled to a state of the art materials system that maximizes power throughput with low thermal resistance. This package is highly suited to power applications and where space is at a premium. These new short circuit rated devices are especially suited for motor control and other totem-pole applications requiring short circuit withstand capability. IMS-1 Units V... |
International Rectifier |
IGBT SIP MODULE Ultra-Fast IGBT The IGBT technology is the key to International Rectifier's advanced line of IMS (Insulated Metal Substrate) Power Modules. These modules are more efficient than comparable bipolar transistor modules, while at the same time having the simpler gate-drive requirements of the familiar power MOSFET. This superior technology has now been coupled to a state of the art materials system that maximizes power throughput with low thermal resistance. This package is highly suited to motor drive applications and where space is at a premium. IMS-1 Absolute Maximum Ratings Parameter VCES IC @ T C = 25°C IC @ T C = 100°C ICM ILM IF @ T C = 100°C IFM VGE VISOL PD @ T C = 25°C PD @ T C = 100°C TJ TSTG Colle... |
 Chilisin Electronics |
SMD Power Inductors SMD Power Inductors - CPUN Series CPUN Series Features Lead free Excellent for power line DC-DC conversion applications Shielded construction Lowest DCR/uH in this package size Handle high transient current spikes without saturation Ultra low buzz noise due to composite construction Support halogen free product Product Identification CPUN Series is designed for low RDC and ultra large current application. Its assembly model and magnetic shielding is suitable for high-density mounting and ultra low buzz noise. Soldering conditions can be easily confirmed when mounting onto board. This series also provides customers with embossed carrier type packaging for automatic mounting ma... |
Chilisin Electronics |
SMD Power Inductors SMD Power Inductors - CPUN Series CPUN Series Features Lead free Excellent for power line DC-DC conversion applications Shielded construction Lowest DCR/uH in this package size Handle high transient current spikes without saturation Ultra low buzz noise due to composite construction Support halogen free product Product Identification CPUN Series is designed for low RDC and ultra large current application. Its assembly model and magnetic shielding is suitable for high-density mounting and ultra low buzz noise. Soldering conditions can be easily confirmed when mounting onto board. This series also provides customers with embossed carrier type packaging for automatic mounting ma... |
Chilisin Electronics |
SMD Power Inductors SMD Power Inductors - CPUN Series CPUN Series Features Lead free Excellent for power line DC-DC conversion applications Shielded construction Lowest DCR/uH in this package size Handle high transient current spikes without saturation Ultra low buzz noise due to composite construction Support halogen free product Product Identification CPUN Series is designed for low RDC and ultra large current application. Its assembly model and magnetic shielding is suitable for high-density mounting and ultra low buzz noise. Soldering conditions can be easily confirmed when mounting onto board. This series also provides customers with embossed carrier type packaging for automatic mounting ma... |
Chilisin Electronics |
SMD Power Inductors SMD Power Inductors - CPUN Series CPUN Series Features Lead free Excellent for power line DC-DC conversion applications Shielded construction Lowest DCR/uH in this package size Handle high transient current spikes without saturation Ultra low buzz noise due to composite construction Support halogen free product Product Identification CPUN Series is designed for low RDC and ultra large current application. Its assembly model and magnetic shielding is suitable for high-density mounting and ultra low buzz noise. Soldering conditions can be easily confirmed when mounting onto board. This series also provides customers with embossed carrier type packaging for automatic mounting ma... |
Chilisin Electronics |
SMD Power Inductors SMD Power Inductors - CPUN Series CPUN Series Features Lead free Excellent for power line DC-DC conversion applications Shielded construction Lowest DCR/uH in this package size Handle high transient current spikes without saturation Ultra low buzz noise due to composite construction Support halogen free product Product Identification CPUN Series is designed for low RDC and ultra large current application. Its assembly model and magnetic shielding is suitable for high-density mounting and ultra low buzz noise. Soldering conditions can be easily confirmed when mounting onto board. This series also provides customers with embossed carrier type packaging for automatic mounting ma... |
Chilisin Electronics |
SMD Power Inductors SMD Power Inductors - CPUN Series CPUN Series Features Lead free Excellent for power line DC-DC conversion applications Shielded construction Lowest DCR/uH in this package size Handle high transient current spikes without saturation Ultra low buzz noise due to composite construction Support halogen free product Product Identification CPUN Series is designed for low RDC and ultra large current application. Its assembly model and magnetic shielding is suitable for high-density mounting and ultra low buzz noise. Soldering conditions can be easily confirmed when mounting onto board. This series also provides customers with embossed carrier type packaging for automatic mounting ma... |
Chilisin Electronics |
Leaded Power Chokes Leaded Power Chokes - CPU Series CPU Series CPU series is designed for low RDC and ultra large current application. Its assembly model magnetic shielded type is suitable for high-density mounting and ultra low buzz noise. Soldering conditions can be easily confirmed when mounting onto the board. This series also provides customers with embossed carrier type packaging for automatic mounting machine. Features l The products contain no Halogen Free and also support Halogen Free products l Excellent for power line DC-DC conversion applications l Shielded construction l Lowest DCR/ uH, in this package s eries l Handle high transient current spikes without saturation l Ultra low buzz noise, due... |
Chilisin Electronics |
Leaded Power Chokes Leaded Power Chokes - CPU Series CPU Series CPU series is designed for low RDC and ultra large current application. Its assembly model magnetic shielded type is suitable for high-density mounting and ultra low buzz noise. Soldering conditions can be easily confirmed when mounting onto the board. This series also provides customers with embossed carrier type packaging for automatic mounting machine. Features l The products contain no Halogen Free and also support Halogen Free products l Excellent for power line DC-DC conversion applications l Shielded construction l Lowest DCR/ uH, in this package s eries l Handle high transient current spikes without saturation l Ultra low buzz noise, due... |
Chilisin Electronics |
Leaded Power Chokes Leaded Power Chokes - CPU Series CPU Series CPU series is designed for low RDC and ultra large current application. Its assembly model magnetic shielded type is suitable for high-density mounting and ultra low buzz noise. Soldering conditions can be easily confirmed when mounting onto the board. This series also provides customers with embossed carrier type packaging for automatic mounting machine. Features l The products contain no Halogen Free and also support Halogen Free products l Excellent for power line DC-DC conversion applications l Shielded construction l Lowest DCR/ uH, in this package s eries l Handle high transient current spikes without saturation l Ultra low buzz noise, due... |
Chilisin Electronics |
Leaded Power Chokes Leaded Power Chokes - CPU Series CPU Series CPU series is designed for low RDC and ultra large current application. Its assembly model magnetic shielded type is suitable for high-density mounting and ultra low buzz noise. Soldering conditions can be easily confirmed when mounting onto the board. This series also provides customers with embossed carrier type packaging for automatic mounting machine. Features l The products contain no Halogen Free and also support Halogen Free products l Excellent for power line DC-DC conversion applications l Shielded construction l Lowest DCR/ uH, in this package s eries l Handle high transient current spikes without saturation l Ultra low buzz noise, due... |